DISCO ZHZZ-SD2000-H1-90-A1783 BB22 Silicon Wafer Diamond Dicing Blades
USD 50.00 USD
Specifications
| Equipment Type | Wafer Cutting System |
| Brand | Disco |
Model # : ZHZZ-SD2000-H1-90-A1783 BB22. DISCO Silicon Wafer Diamond Dicing Blades. Concentration: 90. 7:30am - 4:00pm CT. Office Hours Maple Grove, MN 55369. 9472 Hemlock Lane N. SKU# SB-200242.