1A1R Sintered Diamond Cut Off Wheel 197mm x .060″ x 5/8″ 60/80 Grit Low Con USA
CNC slicing, dicing, and cutting machinery. Grit Size: 60/80. Diamond Depth (Rim): 3mm. Concentration: Low Diamond Concentration. Diamond Thickness (Kerf).060″. Precision lapidary trim and slab saws.
1A1R Sintered Diamond Cut Off Wheel 8″ x .060″ x 5/8″ 30/50 Grit Low Con USA
CNC slicing, dicing, and profiling machinery. Grit Size: 30/50 (Ultra-Coarse). Diamond Depth (Rim): 5mm. Industrial masonry saws and wet tile saws. Concentration: Low Diamond Concentration. Diamond Thickness (Kerf).060″.
1A1R Sintered Diamond Cut Off Wheel 7″ x .060″ x 32mm 30/50 Grit MADE IN EUROPE
Grit Size: 30/50 (Coarse). Arbor Size: 32mm. Theywill not affect the wheel’s cutting performance, structural integrity, or balance. Diamond Thickness.060″. Diamond Depth: 5mm. Concentration: Low Diamond Concentration.
1A1R Diamond Cut Off Blade 6″ x .022″ x 1/2″ Sintered 180 Grit. MADE IN USA
Type: 1A1R (Straight Cut-Off). 6″ Ultra-Thin Sintered Diamond Blade | 180 Grit | 7mm Depth | Made in USA. High-Value Lapidary: Perfect for trimming and slabbingOpal, Turquoise, Jade, and fine Agates.
8″ 1A1R Diamond Metal Bond Cut Off Wheel 8″ x .032″ x 22mm. 80/100 Grit, Low Con
Unlike thin plated blades that wear out quickly, thesintered matrix excels at slicing through Grit: 80/100 (Ideal for efficient slabbing and trimming). Arbor Size: 22mm. Diamond Depth: 5mm (Deep impregnation for extended service life).
1A1R Sintered Diamond Cut Off Wheel 6″ x .063″ x 1.25″ 60/80 Grit Low Con
Lapidary/Gemstones: Slicing semi-precious stones and minerals. Grit Size: 60/80 (Fine grit for smooth, chip-free finishes). Premium, continuous rim diamond blade. The fine60/80 diamond grit and ultra-thin.063″ kerf (thickness) allow for incredibly clean, surgical cuts in fragile or expensive materials.
1A1R Sintered Diamond Cut Off Wheel 4″ x .15″ x 20mm 100/120 Grit Low Con USA
Manufactured in theUSA, this wheel is designed for ultra-thin precision slicing and sectioning of hard, non-ferrous materials. Electronics: Slicing silicon wafers, ferrites, and substrates. Grit Size: 100/120.